Contact Plating:
Current - Reverse Leakage @ Vr:
JESD-30 Code:
Max Operating Temperature:
Min Operating Temperature:
Package Shape:
Peak Reflow Temperature (Cel):
Power Dissipation-Max:
Resistance:
Surface Mount:
Temperature Coefficient:
Terminal Form:
Terminal Position:
Termination:
Time@Peak Reflow Temperature-Max (s):
RFQ
BOM